F&S Bondtec 5330 - Semi-Automatic Ultrasonic Wire Bonder

F&S Bondtec 5330 – Semi-Automatic Ultrasonic Wire Bonder
Manufacturer: F&S Bondtec GmbH
Model: 5330
Country of Origin: Austria

Technical Specifications
Bonding Types: Ball-Wedge, Wedge-Wedge, optional Ribbon Bonding
Wire Types: Aluminium and Gold
Wire Diameter Range: 17.5 µm – 75 µm
Bond Head: Interchangeable heads (Ball-Wedge, Wedge-Wedge, Heavy Wire, Ribbon)
Ultrasonic Frequencies: 60 kHz, 65 kHz, 100 kHz, 140 kHz (selectable)

Motion & Positioning
X/Y Working Area: 100 mm × 100 mm
Step Resolution: 1 µm (programmable)
Z-axis Travel: 60 mm (programmable)
Positioning Accuracy: ±5 µm (3 sigma)
Repeatability: ±3 µm (3 sigma)
Control & Interface
Control System: PC-controlled (Windows OS)
Display: 22" color LCD monitor
Camera: Color CMOS, GigE standard
Connectivity: USB 2.0/3.0, Ethernet
Network: Supports program storage and sharing

Software Features:
Library of loop profiles
Optional pattern recognition
From single bonds to complex bonding programs
Additional Features
Motorized Wire Spool: Optional
Heated Bond Head: Optional
Conversion to Pull/Shear Tester: Available with toolhead and software change
Loop Profile Control: Programmable and repeatable

Physical Specifications
Dimensions (W × D × H): approx. 70 × 65 × 70 cm
Weight: approx. 75 kg
Power Supply: 100–240 VAC, 1 phase, 50/60 Hz
Power Consumption: Max. 500 VA
Vacuum Connection: 6 mm outer diameter (standard)

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