Semi-Automatic Ultrasonic Wire Bonder - Model 5310

Semi-Automatic Ultrasonic Wire Bonder - Model 5310

Manufacturer: F&S Bondtec GmbH – Austria
Country of Origin: Austria

The 5310 model is a semi-automatic ultrasonic wire bonding system designed for basic Wedge-Wedge bonding applications in laboratories, training facilities, and pilot production environments. It is fully controlled via PC, user-friendly, and can be upgraded for pull and shear testing functions.
 

Key Features
Standard support for Wedge-Wedge bonding
Optional upgrade to support Ball-Wedge bonding
Compatible with aluminium and gold wire
Wire diameter range: 17.5 µm to 75 µm
Flexible, interchangeable bond head system
Full PC control with 22-inch color display
Windows-based operating system, USB and Ethernet connectivity
Color CMOS camera with GigE interface
Loop profile library support
Optional pattern recognition capability

Technical Specifications
Ultrasonic Frequency:
Standard: 60 kHz
Optional: 100 kHz
Motion System:
X/Y working area: 100 mm × 100 mm
Step resolution: 1 µm (programmable)
Z-axis travel: 60 mm (programmable)
Positioning accuracy: ±10 µm (3 sigma)
Repeatability: ±7 µm (3 sigma)

Extended Capabilities:
Convertible to pull and shear tester (with appropriate tooling and software)
Optional motorized wire spool
Optional heated bond head
Physical Specifications & Power Requirements
Dimensions (W × D × H): approx. 70 × 65 × 70 cm
Weight: approx. 75 kg
Power supply: 100–240 VAC, 1 phase, 50/60 Hz
Power consumption: max. 500 VA
Vacuum connection: 6 mm diameter (standard)

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