Semi-Automatic Ultrasonic Wire Bonder – Model 5650i HR
Manufacturer: F&S Bondtec GmbH – Austria
Country of Origin: Austria

Key Features:
Wedge-Wedge bonding for heavy wire and ribbon
Supports aluminum wires from 100 µm to 500 µm and ribbons from 300 µm to 2000 µm
Interchangeable bond head system for flexible use
Fully software-controlled via integrated PC
Color LCD monitor with user-friendly interface
Optional Pattern Recognition and real-time Deformation Limit Control (DLC)
Convertible to Pull & Shear Test modes with appropriate tool head

Technical Specifications:
Supported Wire Types:
Round aluminum wire: 100–500 µm (4–20 mil)
Ribbon wire: 300–2000 µm in width, thickness configurable
Optional compatibility with copper or gold wire

Ultrasonic Frequency:
57 kHz (standard for 5650i HR version)
Integrated ultrasonic generator by F&S Bondtec

Bond Head:
2-inch Wedge, V-Groove design
Upgradeable to other head types as needed

Bonding Force:
Maximum: 4000 cN
Adjustable depending on bonding application

Motion System:
X/Y axis working area: 100 × 115 mm
Z-axis travel: 60 mm
Resolution: 0.25 µm
Repeatability: < ±2 µm

Bonding Speed:
Up to 20 wires per minute (depending on wire type and bonding program)
Software & Control:
Integrated PC with specialized bonding software
Windows operating system
Connectivity: USB 2.0, Ethernet
22-inch color LCD touchscreen display
Unlimited program storage
Supports local network access and file sharing

Additional Features:
Pattern recognition (optional)
Real-time Deformation Limit Control (DLC)
Convertible to pull or shear testing by swapping bond head

Physical & Power Specifications:
Dimensions (W × D × H): approx. 70 × 65 × 70 cm
Weight: approx. 75 kg
Power supply: 100–240 VAC, single phase, 50/60 Hz
Power consumption: max. 500 VA
Compressed air requirement: ≥ 4.5 bar
Vacuum line: Ø 6 mm (standard)