F&S BONDTEC

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F&S BONDTEC Austria – Excellence in Wire Bonding & Testing F&S BONDTEC Austria Semiconductor GmbH, founded in 1994 in Braunau am Inn, Austria, is a world-leading supplier of wire bonding and bond testing equipment, serving applications ranging from desktop laboratory tools to fully automated systems for semiconductor and sensor manufacturing. Key Products: Wire bonders – from manual and semi-automatic systems (Series 53, 56i) to fully automatic platforms (Series 58, 86) Bond testers – from manual pull/shear tools to fully automated systems featuring proprietary BAMFIT technology Highlights: High flexibility: quick toolhead changeover; supports various bonding technologies including gold-ball, thin wire, ribbon, and heavy wire Quality & reliability: user-friendly software, Deformation Limit Control (DLC), high-precision camera-based alignment, ideal for medium- to high-volume production Unique Desktop-Micro-Factory design: combines bonding and testing in a single compact platform, ensuring long-term investment and versatile use  
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