Rethink Impossible
Sub-Micron 3D X-ray In Minutes
Advanced semiconductor packaging & FA
Key Features:
3D Imaging on Intact Samples Up to 300 mm Diameter
0.5 µm 3D Spatial Resolution in <15 Minutes
No Beam Hardening Artifacts
0.5 Micron with Unlimited Sample Size
Image with 0.5 micron spatial resolution anywhere on samples up to 300 mm in diameter. With Apex XCT, you can streamline your FA workflows by imaging whole intact packages, wafers, and PCBs, mitigating time-consuming and destructive sample preparation protocols.
Isochronous Data Acquisition
Data acquisition time is independent of sample size when using Apex XCT. Unlike legacy CT systems where bigger samples equate to longer measurement times, the unique geometry of Apex XCT preserves high throughput operation even as sample sizes grow very large, such as printed circuit boards, motherboards, and wafers.
Scans of entire boards at high resolution (8 micron voxel) can be stitched together for reverse engineering applications. The below volume shows 20 stitched volumes, with each scan taking only 36 minutes.
Unbiased Contrast
Apex XCT eliminates many of the imaging artifacts that affect operation of conventional 3D X-ray systems, such as beam hardening, streaking/curtaining, photon starvation, and metal artifacts. Compare the same region imaged with Apex XCT (Left) and a leading Conventional XRM/microCT (Right) – the Apex XCT result demonstrates a dramatic increase in image quality while also offering a significantly reduced scan time.
Hairline RDL Cracks
Conventional CT is unable to detect RDL layer cracks even with 50+ hours of scan time. Why? Because the projected thickness of the RDL layer causes photon starvation. Only Apex can detect sub-micron cracks in the RDL in 30 minutes regardless of the sample size.
Intact SSD Imaged in 3D in 27 Minutes
Apex eliminates the beam hardening artifacts common to conventional CT. Here, an intact SSD was imaged in 3D in 27 minutes with 8.6 micron voxel size. The cross sectional images show stunning contrast and resolution with a complete absence of streaking artifacts.
SSD failure analysis
This example of a 3D integrated circuit (3D NAND) shows the complex architecture of a modern IC, including voids in BGA, redistribution layer & under-bump metallization, and TSVs.
Targeted, Non-Destructive 3D Analysis on Large PCB at 1 micron
An intact GPU (GeForce 1070 Ti) die on its PCB was imaged with 1.0 micron voxels in 34 minutes.
GPU failure analysis
GPU imaged on intact PCB with 1.0 µm resolution. Voids in the solder ball and microbump arrasy can be clearly seen, along with through-silicon vias and 3D chip architecture.
Finding Defects in Minutes… on Full 300 mm Wafer
Failures such as cracks, non-wets, and voids can be found in 3D within minutes at high resolution. Shown on the right is an example of voids determined in a 300mm wafer and imaged within minutes. The TSV diameters are 5 micrometers.
Unbiased 3D Image Contrast Without Beam Hardening
Apex does not suffer from beam hardening like conventional CT. The unique system architecture mitigates many of the artifacts that affect 3D x-ray imaging in semiconductor inspection & FA, providing crisp, clean reconstructions in a fraction of the time.
