Thin Wire Wedge-Wedge Bonder 5630i

Manufacturer: F&S Bondtec – Austria
Model: 5630i
Origin: Austria

The system is fully controlled via a personal computer (PC) and allows programming of an unlimited number of bond connections.

Key Features
Precision Alignment:
Pre-programmed alignment points are precisely positioned using an integrated camera system and digital crosshair.

Automated Bonding:
Once alignment is complete, the pre-defined bonding sequence is executed automatically.

Operating Modes
Single Bond Mode:
Ideal for repair or sample testing.
Supports semi-automatic or manual bonding of individual wires.
Multi-Wire Mode:
Enables programming and bonding of multiple wires on chips or various sample layouts.
Supports both semi-automatic and fully automatic operation.

Versatility
Compatible with gold wire and heavy aluminium wire.
In addition to bonding, the system can be converted into a pull and shear tester by changing the bond head and uploading the appropriate software.

Technical Specifications
Wire Types:
Aluminium and gold wires, diameter from 12.5 µm to 75 µm
Uses standard 2-inch wire spools

Bond Head:
Wedge-Wedge type for fine wire bonding
Standard wedge: 1 inch length, 45° wire feed angle
Motorized Wire Spool:
Optional upgrade available
Ultrasonic Generator:
F&S Ultrasonic Generator, standard frequency: 100 kHz
Optional frequencies: 65 kHz or 140 kHz

Bonder Base & Motion System
Axes & Travel Range:
X/Y work area: 100 x 100 mm
Step resolution: 1 µm, fully programmable
Z-axis travel: 60 mm, programmable
Control System:
PC: Dual-Core, Windows OS
Connectivity: Ethernet, USB 2.0 / 3.0
Display: 22-inch color LCD
Camera: Color CMOS, GigE standard
Network support: Program storage and sharing via LAN

Software & Accuracy
Supports simple to complex bonding programs
Loop shapes can be saved and managed via a built-in library
Pattern recognition: Optional feature
Accuracy Specifications (on F&S Bondtec standard samples):
Bond position accuracy: ±5 µm (3 sigma), tool-included, wire-excluded
Repeatability: ±3 µm (3 sigma), tool-included, wire-excluded
Loop height accuracy: ±5 µm (3 sigma) for 25 µm aluminium wire
Bonding speed:
~1 wire every 2–3 seconds

Dimensions & Power
Dimensions (W × D × H): 70 × 65 × 70 cm
Weight: approx. 75 kg
Power supply: 100–240 VAC, 1-phase, 50/60 Hz, max. 500 VA
Vacuum line: 6 mm outer diameter, standard type
Heater controller: Integrated, adjustable from 0 to 250 °C