Advanced climate control, temperature stability of ±0.1°C, ISO 4 environment.
Integrated CCD camera and macro camera for effortless alignment.
Supports 4 write modes to optimize performance according to specific applications.
Generates complex structures directly from CAD files (DXF, BMP, STL, X,Y,Z-ASCII) with up to 1023 grayscale levels.
Comprehensive software: manipulate and merge CAD files, design complex patterns, and optimize structures.
Detailed Description
Technology & Principle
The DWL 2000 GS / 4000 GS is a Grayscale laser lithography system utilizing 1023 gray levels (unlike traditional binary lithography). 3D CAD data maps directly to laser intensity, enabling the fabrication of continuous 2.5D structures (microlens arrays, blazed gratings) in a single step.
Binary lithography requires multiple masks and alignment steps, leading to overlay errors. For microlenses/holograms, old methods take weeks due to mask design, manufacturing, and repetitive alignment. Photomask costs are extremely high for complex structures. Furthermore, standard software lacks direct 3D CAD to laser signal conversion, causing geometric distortions.
A single-step grayscale process saves cost and mask manufacturing time, making it faster than e-beam lithography. It achieves ultra-smooth surfaces (5nm roughness). The software imports STL/DXF/BMP files for automatic mapping and fully supports GenISys BEAMER.
Integration & Expansion
Easily integrates with profilometers and microscopes; compatible with AZ 1500 and AZ 4562 photoresists; cleanroom-ready.
The DWL 2000 GS / 4000 GS meets industrial standards, supporting CAD export with up to 1023 grayscale levels. Proprietary Grayscale technology from Heidelberg Instruments enables the fabrication of 2.5D structures and microlenses with surface roughness down to 5nm. An optimal solution for manufacturing holograms, light diffusers, and Fresnel lenses in nanophotonics and micro-optics research.
The µMLA is a compact yet powerful tabletop maskless lithography solution, offering ultimate flexibility for nano-research and MEMS labs. By enabling direct writing from CAD files, it eliminates the costs and time associated with traditional photomask fabrication.
EIS-200ERP (Elionix Ion Beam Etching/Sputtering System): Đây là một hệ thống quang khắc/phún xạ chùm ion, cho phép ăn mòn vật liệu ở cấp độ nano và lắng đọng bằng cách sử dụng chùm ion ECR. EIS-220P: Một mẫu máy mới hơn, cũng thuộc dòng sản phẩm quang khắc/phún xạ chùm ion ECR.
The PlasmaPro 80 is a compact, open-loading tool for plasma etch and deposition. It represents the next generation of plasma systems. This system is ideally suited for R&D or small-scale production, capable of processing from the smallest wafer pieces up to 200mm wafers. Its open load design allows for fast wafer loading and unloading, making it ideal for research, prototyping, and low-volume production.
