The PRO Line PVD 200 is compatible with the following techniques:
KJLC's software allows user friendly recipe creation along with a reliable, uninterruptable processing module that allows process completion, regardless of the state of the computer user interface. For more information on this intuitive, unique, and reliable software package, please see the Software Tab.
The PRO Line PVD 200 offers four types of high vacuum pumping on its process chamber, a Pfeiffer 790 L/s turbomolecular pump (standard), as well as an optional 1250L/s Pfeiffer turbomolecular pump, Brooks CTI-8F 1500 L/s, or 3000 L/s cryo pump. The Pfeiffer turbomolecular pumps being a good choice for overall cost effective high quality pumping particularly for sputtering applications. The Brook CTI cryo pumps find use in applications that require the lowest vacuum possible, particularly for thermal evaporation and electron beam applications.
The chart to the right demonstrates average expected pumping performance by pump type for an outfitted PRO Line PVD 200 process chamber that is clean and dry with (5) TORUS 3" Mag-keeper sources installed and a 3' long 1.5" metal flex bellows roughing line.
The PRO Line PVD 200 has been designed for optimal uniformities and allows ultimate base pressures otherwise not achievable in modular R&D systems until now. The chart to the left shows average expected uniformity by deposition type and substrate wafer diameter. Thickness measurements were made using a Profilometer or spectral reflectometer.
The actual uniformity achievable will be a function of the final configuration of the system and process parameters. TORUS® sources are operated at typical sputtering pressures (< 20 mTorr) and utilize Si wafers for deposition. SiO2 Target run with RF Power, film thickness >=500Å. Al Target run with DC Power, film thickness >=1500Å. Ni Target run with High Strength TORUS® & DC Power, film thickness >=1500Å.
KJLC electron beam deposition runs utilize Si wafers for deposition. Ti evaporant material with film thickness >=1500Å.
All Films are measured on a properly calibrated Profilometer, Reflectometer or Ellipsometer (if applicable).
Measurement points are taken starting at the center of the substrate and then radially outward every 0.5 inches (12.7mm), nominally (reference figure to the right).
Uniformity calculation formula is: ((Max - Min) / (2 x Avg)) x 100% with a 0.2 inch (5mm) edge exclusion.
Specifications
Process Chamber Volume | 19.25” wide x 20.5” deep x 24” high (488.95mm Wide x 520.7mm Deep x 609.6mm High) Ideal for sputtering applications or shorter throw evaporation or e-beam | 155 liters |
19.25” wide x 20.5” deep x 36” high (488.95mm Wide x 520.7mm Deep x 914.4mm High) Ideal for long throw evaporation or e-beam | 232 liters | |
Aluminum, O-ring sealed, hinged, front access door O-ring sealed side plates (2), allow for maximum modularity and upgradeability |
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Process Chamber Construction | 304L Stainless Steel with 6061 Aluminum Hinged Door | |
Cabinet Construction | Carbon Steel, Fully Enclosed Instrument Rack, Open Chamber Area, Gray Powder Coat Finish | |
Deposition Sources (Available in various combinations) | Up to (8) 2' or 3” Torus® Magnetron Sputtering Cathodes | |
4-Pocket 8cc Electron Beam Source, 8-Pocket 12cc, and 6-Pocket 20cc Available | ||
Up to (6) 4'' Thermal Evaporation Sources | ||
Up to (2) LTE Organic Material Evaporation Sources | ||
Deposition Orientation | Sputter Up, Evaporation Up | |
Substrate Cleaning | Ion Source or Bias eH400 end-Hall ion Source, KDC40 gridded ion source, or 100W RF Bias | |
Substrate Size (max) | Single 8'' (200mm) with 20 RPM Max Variable Rotation | |
Substrate Heating/Cooling | Up to 850°C or water cooled | |
Standard Vacuum Pumping Base Pressure (CDE) | 790 l/sec Turbo Pump — 9 x 10-7 torr (1.2 x 10-6 mbar) 1250 l/sec Turbo — 5 x 10-7 torr (6.7 x 10-7 mbar) 1500 l/sec Cryo Pump Available — 8 x 10-8 torr (1.1 x 10-7 mbar) 3000 l/sec Cryo Pump Available — 5 x 10-8 torr (6.7 x 10-8 mbar) | |
Process Gas | 4 Channel Mass Flow Control with 3-position or variable position gate valve | |
System Control | PC-Based HMI, eKLipseTM advanced recipe control and datalogging | |
Required Power (typical, based on options) | 208VAC, 3Ø, 50/60 Hz; Optional 380VAC, 3Ø, 50/60 Hz | |
Available Certifications, Markings | Systems within the European Economic Area (EEA) are CE marked and comply with the following EU directives: -Low Voltage Directive (LVD) 2014/35/EU -Electromagnetic Compatibility (EMC) Directive 2014/30/EU Systems outside of the EEA can be CE marked as required CSA and NRTL certification is available | |
Warranty | 12 Months upon Shipment | |
Overall Dimensions (approx) | 59.5” (1511.3mm) wide x 32” (812.8mm) deep x 75.9” (1928mm) high | |
Weight (approx) | 2,200 lbs (998 kg) | |
Applications
Designed for university, industrial, and government lab R&D thin film deposition
OLED/PLED and organic electronics applications
Photovoltaics and semiconductor devices
Optics and decorative coatings
Small batch production
